PRODUCT
제품소개
가공공정능력
Back Plane Board
- 적용영역 : 네트워크용, 서버/ 스트리지, 우주 / 항공
- Layer Count : 40 Layers
- Line And Space : 175 / 188㎛
- Thickness : ~ 6.0 mm
- Micro Via(Mechanical) : 0.20 mm
High Layer Board
- 적용영역: 자동차, 가전, 모바일 , IoT
- Layer Count : 26 Layers
- Line And Space : 80 / 100㎛
- Thickness : 1.0 mm
- Micro Via(Mechanical) : 0.20 mm
Rigid Flexible(RF) Board
- 적용영역: 자동차, 가전, 모바일 , IoT
- Layer Count : 3/4 Layers
- Line And Space : 50 / 60㎛
- Thickness : 0.83mm( at 12Layer)
- Micro Via(Mechanical) : 0.10 mm
Build Up Board
- 적용영역: 디스플레이, 차량, 가전, 모바일 , IoT
- Layer Count : 22 Layers
- Line And Space : 40 / 40㎛
- Thickness : 0.6mm( at 12Layer)
- Micro Via(Mechanical) : 0.15 mm
Package ( CSP , Flip Chip CSP)
- 적용영역: 차량, 가전, 모바일 , 조명
- Layer Count : 3/4 Layers
- Line And Space : 25 / 25㎛
- Thickness : 90 ± 10 ㎛
- Micro Via(Mechanical) : 0.075 mm